Idec High Performance Series Manuel d'utilisateur Page 236
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- Table des matières
- MARQUE LIVRES
Noté. / 5. Basé sur avis des utilisateurs
Chapter 2
218
External Device Setup Manual
• With the MICRO/I, reference device values are specified in units of 16-bit devices. Therefore, to specify a value for
DINT, REAL, TIMER (a 32-bit device), or PRE and ACC elements in the CONTROL structure, it is necessary to dou-
ble the reference device value in the PLC before specifying it.
Example 1: If 1 is specified as the reference device value for DINT[0], the upper word for DINT[0] is used. To use DINT[1],
specify a reference device value of 2.
Script
[LM 200] = OFFSET(tag[0],[LDR 0]);
Operation description
When the value of LDR0 is 2, the value of tag[1], the device 2 words from tag[0], is read and stored in LDR200.
Example 2: If 1 is specified as the reference device value for TIMER[0].PRE, the upper word for TIMER[0].PRE is used. To
use TIMER[1].PRE, specify a reference device value of 2.
Script
[LM 200] = OFFSET(tag[0].PRE,[LDR 0]);
Operation description
When the value of LDR0 is 2, the value of tag[1].PRE, the device 2 words from tag[0].PRE, is read and stored in
LDR200.
Read
0000 0002 LDR0
＋2
12341234LDR200 tag[1]
tag[0]
Read
0000 0002 LDR0
＋2
12341234LDR200 tag[1].PRE
tag[0].PRE
- External Device Setup Manual 1
- SAFETY PRECAUTATIONS 2
- Revision history 5
- Trademarks 6
- Symbols Used in this Document 7
- Chapter 2 Connection to a PLC 11
- Chapter 5 Modbus 16
- PLC Link Communication 19
- 1 PLC Link Communication 20
- 2 Compatible PLC Units 21
- 2.2 Mitsubishi 23
- 2.3 Omron 25
- 2.4 Allen-Bradley 27
- 2.7 SHARP 29
- 2.8 Hitachi 29
- 2.12 Schneider 31
- 2.13 Modicon 31
- 2.14 Panasonic Electric Works 31
- 2.17 FANUC 33
- 2.18 YOKOGAWA 33
- 2.20 Toshiba 35
- 1.2 System Configuration 47
- 1.3 Connection Diagram 55
- 1.4 Environment Settings 67
- 2Mitsubishi 70
- 2.3 Connection Diagram 87
- Connection to a PLC 101
- 2.4 Environment Settings 113
- 2.4.6 MELSEC-FX Series 115
- 2.5.2 MELSEC-AnN (LINK) 119
- 2.5.4 MELSEC-AnN (CPU) 121
- 2.5.6 MELSEC-A1S/A2C (CPU) 123
- 2.5.7 MELSEC-Q/QnA (Link) 125
- 2.5.8 MELSEC-Q (CPU) 127
- 2.5.9 MELSEC-FX (CPU) 129
- 2.5.11 MELSEC-FX3UC (CPU) 131
- 3.1 Connection Table 135
- 3.3 Connection Diagram 145
- 4 Allen-Bradley 180
- 4.2 System Configuration 183
- 4.3 Connection Diagram 187
- 4.4 Environment Settings 205
- 4.4.3 PLC-5 207
- 4.5.2 SLC 500 (Half Duplex) 215
- 4.5.4 Ethernet/IP 221
- 4.7.2 Setting prosess 233
- 4.7.6 Restrictions 237
- 5SIEMENS 238
- 5.2 System Configuration 239
- 3 Address 0 - 510 257
- 3 DB No. 1 - 255 257
- 6 Keyence 258
- 6.2 System Configuration 259
- 6.3 Connection Diagram 261
- 6.4 Environment Settings 273
- 6.5 Usable Devices 275
- 6.5.2 KV3000/5000 (Ethernet) 277
- 7.2 System Configuration 281
- 7.3 Connection Diagram 283
- 7.5 Usable Devices 303
- 8Hitachi 305
- 8.4 Environment Settings 317
- 9 JTEKT (Toyoda) 320
- 9.3 Connection Diagram 321
- 9.4 Environment Settings 327
- 10 Toshiba Machine Works 332
- 10.2 System Configuration 333
- 10.4 Environment Settings 341
- 11 GE Fanuc Automation 343
- 11.3 Connection Diagram 345
- (RS422/485) to MICRO/I 347
- 11.4 Environment Settings 355
- 11.5 Usable Devices 357
- 12 Panasonic Electric Works 358
- 12.2 System Configuration 359
- 12.4 Environment Settings 381
- 12.5 Usable Devices 383
- 13.2 System Configuration 385
- 13.3 Connection Diagram 387
- 13.4 Environment Settings 401
- 13.5 Usable Devices 403
- 14.2 System Configuration 405
- 14.3 Connection Diagram 407
- 14.5.3 DirectLogic (Ethernet) 419
- 15 FANUC 420
- 15.2 System Configuration 421
- 15.5 Usable Devices 431
- 16 YOKOGAWA 432
- 16.2 System Configuration 433
- 16.3 Connection Diagram 435
- 16.4 Environment Settings 443
- 17 INVERTER 448
- 17.3 Connection Diagram 449
- 17.5 Usable Devices 453
- • NB Series 457
- • NJ Series 457
- • NS Series 457
- 18.3 Connection Diagram 461
- 18.5.2 MICREX-F 489
- 18.5.3 MICREX-SX 491
- 19 Toshiba 492
- 19.2.4 PROSEC T Series T2E 495
- 19.3 Connection Diagram 497
- 19.4 Environment Settings 515
- 20 LS Industrial Systems 518
- 20.2 System Configuration 519
- 20.3 Connection Diagram 521
- 20.5 Usable Devices 531
- 21 VIGOR 532
- 21.2 System Configuration 533
- 21.3 Connection Diagram 535
- 21.5 Usable Devices 551
- 22 Emerson 552
- 22.2 System Configuration 553
- 22.5 Usable Devices 557
- O/I Link Communication 563
- 1 O/I Link Communication 564
- • HG9Z-2G1 565
- 3 Communication Service 571
- 5 Notice to O/I link 574
- 6.1 Conditions 575
- DM Link Communication 577
- 1 Outline 578
- 2 System Configuration 579
- 3.2.2 2-wire 587
- 4.1 Communication Method 591
- 4.2 Communication Conditions 591
- 4.3 Flow control 591
- 5 Data Memory (DM) Allocation 593
- • Command (Response) 595
- 7.1.4 Read Sequence 597
- 7.2.2 Response 599
- 7.2.3 Write Sequence 599
- 7.3 Transmission Control 601
- 7.4 Clear Command 603
- 8.1.2 Response 607
- 8.2 Write 609
- 8.2.3 Write Sequence 611
- 9 BCC Calculation 613
- 10 Error Codes 614
- Chapter 5 Modbus 615
- 1 Modbus 616
- 1.1.2 Compatible PLCs 617
- • Serial Port on CPU module 619
- 1 Modbus 627
- 1.5 Usable Devices 635
- 1.6.2 System Configuration 637
- 1.6.3 Wiring 637
- 1.6.4 Devices 637
- 1.6.6 Communication Format 639
- 1:N Communication 647
- 3.3.2 RS422/485 4-wire system 655
- 4 1:N Communication Operation 658
- 5 Restrictions 660
- Communication Cables 661
- 1 Communication Cables 662
- Numerics 676
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